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Catalyst carriers and electromagnetic shielding materials Professional

2 months ago Electronics Malumfashi   39 views

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Location: Malumfashi
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Nickel foam is low density permeable material with numerous applications. The defining characteristic of these foams is a very high porosity, typically 75-95% of the volume consisting of void spaces. Ceramic foam is often used for thermal insulation, acoustic insulation, adsorption of environmental pollutants, filtration of molten metal alloys, and as substrate for catalysts requiring large internal surface area. Nickel foam is generally immediately available in most volumes.

Copper foam is a new multifunctional material with a large number of connected or unconnected holes evenly distributed on the matrix. Copper foam has good conductivity and malleability. It has lower cost and better conductivity than nickel foam and can be used to prepare battery anode (carrier) materials, catalyst carriers and electromagnetic shielding materials. Copper foam has good mechanical properties and processability, great electric and thermal conductivity and the structure has a large number of pores, but the alkali resistance, tensile strength and malleability of metallic copper are still exist, coupled with its good electromagnetic shielding and noise absorption function, copper foam has a wide range of applications.

Fe foam alloyed with phosphorus was prepared with the aim of enhancing the mechanical properties and manipulating the corrosion rate. Two different types of Fe-P foams containing 0.5 wt.% of P were prepared: Fe-P (I) foams from a phosphated carbonyl iron powder and Fe-P (II) foams from a mixture of carbonyl iron and commercial Fe 3 P.

Conductive foam is similar to standard packaging foams but with one crucial difference – the addition of carbon to the polymer mix during the manufacturing process to provide a high level of conductivity. This allows any electric current to pass through the cell structure of the foam and away from the component. Generally, the foam will have permanent conductive performance, meaning it is ideal for multi-trip packaging and in-plant handling applications. Its performance isn’t affected by atmospheric conditions.